Part Number Hot Search : 
080CT ISL12058 XP04878 CDLL4923 SS443A 27C100 1N4148 74HC405
Product Description
Full Text Search
 

To Download FDD8778 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 FDD8778/FDU8778 N-Channel PowerTrench(R) MOSFET
May 2006
FDD8778/FDU8778 N-Channel PowerTrench(R) MOSFET
25V, 35A, 14m Features General Description
Max rDS(on) = 14.0m at VGS = 10V, ID = 35A Max rDS(on) = 21.0m at VGS = 4.5V, ID = 33A Low gate charge: Qg(TOT) = 12.6nC(Typ), VGS = 10V Low gate resistance RoHS compliant
LE
A
REE I DF
tm
This N-Channel MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers. It has been optimized for low gate charge, low rDS(on) and fast switching speed.
Application
DC-DC for Desktop Computers and Servers VRM for Intermediate Bus Architecture
GDS
MOSFET Maximum Ratings TC = 25C unless otherwise noted
Symbol VDS VGS ID EAS PD TJ, TSTG Parameter Drain to Source Voltage Gate to Source Voltage Drain Current -Continuous (Package Limited) -Continuous (Die Limited) -Pulsed Single Pulse Avalanche Energy Power Dissipation Operating and Storage Temperature (Note 1) (Note 2) Ratings 25 20 35 40 145 24 39 -55 to 175 mJ W C A Units V V
M ENTATIO LE N MP
D
G D I-PAK (TO-251AA) S Short Lead I-PAK G
S
Thermal Characteristics
RJC RJA RJA Thermal Resistance, Junction to Case TO-252,TO-251 Thermal Resistance, Junction to Ambient TO-252,TO-251 Thermal Resistance, Junction to Ambient TO-252,1in2 copper pad area 3.8 100 52 C/W C/W C/W
Package Marking and Ordering Information
Device Marking FDD8778 FDU8778 FDU8778 Device FDD8778 FDU8778 FDU8778_F071 Package TO-252AA TO-251AA TO-251AA
1
Reel Size 13'' N/A(Tube) N/A(Tube)
Tape Width 12mm N/A N/A
Quantity 2500 units 75 units 75 units
www.fairchildsemi.com
(c)2006 Fairchild Semiconductor Corporation FDD8778/FDU8778 Rev. A
FDD8778/FDU8778 N-Channel PowerTrench(R) MOSFET
Electrical Characteristics TJ = 25C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BVDSS BVDSS TJ IDSS IGSS Drain to Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate to Source Leakage Current ID = 250A, VGS = 0V ID = 250A, referenced to 25C VDS = 20V, VGS = 0V VGS = 20V TJ = 150C 25 17.2 1 250 10 V mV/C A A
On Characteristics
VGS(th) VGS(th) TJ rDS(on) Gate to Source Threshold Voltage Gate to Source Threshold Voltage Temperature Coefficient VGS = VDS, ID = 250A ID = 250A, referenced to 25C VGS = 10V, ID = 35A Drain to Source On Resistance VGS = 4.5V, ID = 33A VGS = 10V, ID = 35A TJ = 175C 1.2 1.5 -5.3 11.6 15.7 18.2 14.0 21.0 23.8 m 2.5 V mV/C
Dynamic Characteristics
Ciss Coss Crss Rg Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance VDS = 13V, VGS = 0V, f = 1MHz f = 1MHz 635 160 108 1.3 845 215 162 pF pF pF
Switching Characteristics
td(on) tr td(off) tf Qg(TOT) Qg(5) Qgs Qgd Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge at 10V Total Gate Charge at 5V Gate to Source Gate Charge Gate to Drain "Miller"Charge VGS = 0V to 10V VGS = 0V to 5V VDD = 13V ID = 35A Ig = 1.0mA VDD = 13V, ID = 35A VGS = 10V, RGS = 27 6 22 43 32 12.6 6.7 2.1 3.2 12 35 69 51 18 9.4 ns ns ns ns nC nC nC nC
Drain-Source Diode Characteristics
VSD trr Qrr Source to Drain Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge VGS = 0V, IS = 35A VGS = 0V, IS = 15A IF = 35A, di/dt = 100A/s IF = 35A, di/dt = 100A/s 1.03 0.89 25 17 1.25 1.2 38 26 V ns nC
Notes: 1: Pulse time < 300s, Duty cycle = 2%. 2: Starting TJ = 25oC, L = 0.1mH, IAS = 22A ,VDD = 23V, VGS = 10V.
FDD8778/FDU8778 Rev. A
2
www.fairchildsemi.com
FDD8778/FDU8778 N-Channel PowerTrench(R) MOSFET
Typical Characteristics TJ = 25C unless otherwise noted
70 60
ID, DRAIN CURRENT (A)
NORMALIZED DRAIN TO SOURCE ON-RESISTANCE PULSE DURATION = 80s DUTY CYCLE = 0.5%MAX VGS = 10V VGS = 5.0V VGS = 4.5V VGS = 3.5V VGS = 4.0V
4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5
VGS = 10V VGS = 5V VGS = 4V VGS = 4.5V VGS = 3.0V VGS = 3.5V PULSE DURATION = 80s DUTY CYCLE = 0.5%MAX
50 40 30 20 10 0 0.0 0.5 1.0 1.5
VGS = 3V
2.0
2.5
3.0
3.5
0
10
VDS, DRAIN TO SOURCE VOLTAGE (V)
20 30 40 50 ID, DRAIN CURRENT(A)
60
70
Figure 1. On Region Characteristics
Figure 2. Normalized On-Resistance vs Drain Current and Gate Voltage
50
rDS(on), DRAIN TO SOURCE ON-RESISTANCE (m)
NORMALIZED DRAIN TO SOURCE ON-RESISTANCE
1.8 1.6 1.4 1.2 1.0 0.8 0.6 -80
ID = 35A VGS = 10V
ID = 35A
PULSE DURATION = 80s DUTY CYCLE = 0.5%MAX
40 30
TJ = 175oC
20 10 0 3.0
TJ = 25oC
-40 0 40 80 120 160 TJ, JUNCTION TEMPERATURE (oC)
200
4.5 6.0 7.5 9.0 VGS, GATE TO SOURCE VOLTAGE (V)
10
Figure 3. Normalized On Resistance vs Junction Temperature
70 ID, DRAIN CURRENT (A) 60 50 40 30 20 10 0 1.0
TJ = 175oC TJ = 25oC TJ = - 55oC VDD = 5V
Figure 4. On-Resistance vs Gate to Source Voltage
100
IS, REVERSE DRAIN CURRENT (A)
PULSE DURATION = 80s DUTY CYCLE = 0.5%MAX
VGS = 0V
10 1 0.1 0.01 1E-3 0.0
TJ = 175oC TJ = 25oC
TJ = -55oC
1.5 2.0 2.5 3.0 3.5 4.0 4.5 VGS, GATE TO SOURCE VOLTAGE (V)
5.0
0.2 0.4 0.6 0.8 1.0 1.2 VSD, BODY DIODE FORWARD VOLTAGE (V)
1.4
Figure 5. Transfer Characteristics
Figure 6. Source to Drain Diode Forward Voltage vs Source Current
3 www.fairchildsemi.com
FDD8778/FDU8778 Rev. A
FDD8778/FDU8778 N-Channel PowerTrench(R) MOSFET
Typical Characteristics TJ = 25C unless otherwise noted
VGS, GATE TO SOURCE VOLTAGE(V)
10 8
CAPACITANCE (pF)
2000 1000
Ciss
f = 1MHz VGS = 0V
6 4 2 0
VDD = 10V
VDD = 13V
Coss
VDD = 16V
Crss
100
0
3
6 9 Qg, GATE CHARGE(nC)
12
15
40 0.1
1 10 VDS, DRAIN TO SOURCE VOLTAGE (V)
30
Figure 7. Gate Charge Characteristics
50
Figure 8. Capacitance vs Drain to Source Voltage
50 ID, DRAIN CURRENT (A) 40
VGS=10V
IAS, AVALANCHE CURRENT(A)
10
TJ = 25oC
30 20
VGS=4.5V
TJ = 125oC TJ = 150oC
10
RJC = 3.8 C/W
o
1 1E-3
0.01 0.1 1 10 tAV, TIME IN AVALANCHE(ms)
100
0 25
50
75
100
125
o
150
175
TC, CASE TEMPERATURE ( C)
Figure 9. Unclamped Inductive Switching Capability
400 100 ID, DRAIN CURRENT (A)
10us
Figure 10. Maximum Continuous Drain Current vs Case Temperature
P(PK), PEAK TRANSIENT POWER (W)
5000
VGS = 10V
TC = 25oC FOR TEMPERATURES ABOVE 25oC DERATE PEAK CURRENT AS FOLLOWS: I = I25 175 - T C ---------------------150
1000
100us
10
LIMITED BY PACKAGE
100
1ms 10ms
SINGLE PULSE TJ = MAX RATED TC = 25OC
1
OPERATION IN THIS AREA MAY BE LIMITED BY rDS(on)
DC
SINGLE PULSE
0.1 1
10 -5 10
10
-4
10 VDS, DRAIN-SOURCE VOLTAGE (V)
50
10 10 10 t, PULSE WIDTH (s)
-3
-2
-1
10
0
10
1
Figure 11. Forward Bias Safe Operating Area
Figure 12. Single Pulse Maximum Power Dissipation
FDD8778/FDU8778 Rev. A
4
www.fairchildsemi.com
FDD8778/FDU8778 N-Channel PowerTrench(R) MOSFET
Typical Characteristics TJ = 25C unless otherwise noted
2
DUTY CYCLE-DESCENDING ORDER D = 0.5 0.2 0.1 0.05 0.02 0.01
1
NORMALIZED THERMAL IMPEDANCE, ZJC
PDM
0.1
t1 t2
SINGLE PULSE
NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZJC x RJC + TC
0.01 -5 10
10
-4
10
-3
10
-2
10
-1
10
0
10
1
t, RECTANGULAR PULSE DURATION (s)
Figure 13. Transient Thermal Response Curve
FDD8778/FDU8778 Rev. A
5
www.fairchildsemi.com
FDD8778/FDU8778 N-Channel PowerTrench(R) MOSFET
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACExTM ActiveArrayTM BottomlessTM Build it NowTM CoolFETTM CROSSVOLTTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACTTM FACT Quiet SeriesTM
FAST(R) FASTrTM FPSTM FRFETTM GlobalOptoisolatorTM GTOTM HiSeCTM I2CTM i-LoTM ImpliedDisconnectTM IntelliMAXTM
Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM DISCLAIMER
ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM
PowerEdgeTM PowerSaverTM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM ScalarPumpTM SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM
SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TCMTM TinyLogic(R) TINYOPTOTM TruTranslationTM UHCTM UltraFET(R) UniFETTM VCXTM WireTM
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I19
Preliminary
No Identification Needed
Full Production
Obsolete
Not In Production
FDD8778/FDU8778 Rev. A
6
www.fairchildsemi.com


▲Up To Search▲   

 
Price & Availability of FDD8778

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X